LEONID Provides Working Capital Line To Trion Technology A Government Subcontractor

LEONID provides a working capital line to Trion Technology, a government subcontractor working with multiple Tier-1 Primes.

LEONID is thrilled to be working with one of the largest domestic US suppliers of custom Plasma Etch and Deposition Equipment. This capital will help Trion build its innovative Wafer Bonding equipment for various bonding processes (Direct, Eutectic, Anodic and  Thermal Compression). Their innovative services and solutions are playing a critical role in the development and improvement of semiconductor quality and performance.

“We are excited to be partnering with Trion Technology, a company that has been one of the industry’s leaders for 30 years,” said James Parker. “The national strategic importance of semiconductor development has never been higher, and we are thrilled to be a small part of the solution.”